wirebonds.com Wirebond

Title: Wirebond
Keywords: wirebond, capillary, cob, chip on board, diebond, mcm, multi chip module, security bond, wirebonds
Description: Wirebonds involve ultrasonically welding thin wire to a pad on a bare semiconductor die-chip and the other end of the wire to a conductive pad
wirebonds.com is ranked 0 in the world (amongst the 40 million domains). A low-numbered rank means that this website gets lots of visitors. This site is relatively popular among users in the united states. It gets 50% of its traffic from the united states .This site is estimated to be worth $0. This site has a low Pagerank(0/10). It has 1 backlinks. wirebonds.com has 43% seo score.

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StatusCode 200
Content-Type text/html
Date Mon, 08 Aug 2016 11:17:54 GMT
Server Apache/2.2.24 (Unix) mod_ssl/2.2.24 OpenSSL/1.0.0-fips DAV/2 mod_bwlimited/1.4 mod_qos/10.10 mod_perl/2.0.6 Perl/v5.10.1

wirebonds.com Keywords accounting

Keyword Count Percentage
wirebond 21 2.38%
capillary 5 0.63%
cob 1 0.04%
chip on board 1 0.18%
diebond 6 0.59%
mcm 3 0.12%
multi chip module 1 0.24%
security bond 3 0.54%
wirebonds 5 0.63%

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Wirebond Wirebond Wirebonds and Wirebond Information Wirebonds involve ultrasonically welding thin wire to a pad on a bare semiconductor die-chip and the other end of the wire to a conductive pad on a substrate. The wire is usually gold or aluminum and is usually very thin, often .001 to .0013 of an inch. If the wirebond substrate is a circuit board, it is called Chip On Board COB. The printed circuit board can be either ceramic (thick film) or fiberglass (FR4 or green). Another kind of substrate is a Multi Chip Module MCM which is a small housing that may contain a small board or insert molded metal conductors. By wirebonding 2 or more die chips in an MCM and possibly adding some other components such as resistors or capacitors, you can make an MCM with a special function. Before a wirebond is made, the bare die must be diebonded to the substrate first. What is the purpose of wirebonding? Wirebonding is used to connect a bare semiconductor to the outside world. Doesn't such a thin wire cause problems? Yes, if you are not careful, it can cause a multitude of problems. Probably the worst of the problems can be a wire bond that "passes" during factory testing, but fails in the field. Why not use a thicker, more durable wire? Because the semiconductor die is also fragile. A thick wire could have an effect similar to using a thick nail on a small, thin piece of wood. Also, the wire itself is not always what fails. The bond or "adhesion" of the wire can fail at either end. Are there different types of wirebonding? Yes There is ball bonding and wedge bonding. Isn't there another way to do this? Yes. You could buy pre-packaged chips that have the bare die in a plastic case with terminals sticking out. But, in high density applications, pre-packaged chips take up more space. Diebonds Before parts are wirebonded, the bare die chips must be diebonded. Although the concept is simple - put some conductive epoxy on the board and place the die on the epoxy, there are many complex issues involved with diebonding. The placement must be accurate or else it will hinder the wirebonding operation. Pull Test Grades Pull Test Grade Pictures To test the strength of wirebonds, a destructive pull test should be performed on a small sample of normal production parts. Although inexpensive dummy parts could be used to diagnose a persistant machine problem, many problems can be caused or aggrevated by variations in the parts; therefore destructive pull tests must be done with normal production parts. A pull test involves using a sensitive instrument with a very small hook to pull on the wire with increasing force until the wire breaks, at which time the instrument records the maximum force before the wire broke. The location of the hook makes a difference because if it is too far from the ball bond and too close to the 2nd bond (fish-tail or wedge bond), it will tend to peel the 2nd bond off of the substrate too easily. Both the amount of force needed to break the bond and the location of the break are important. It makes a difference where the area of breakage is because different areas of breakage are caused by different things. Examples of something that can be done specifically to correct weak or erratic bond failures on the board, second bond, or fish tail bond. Security Bonds If all other possibilities such as cleanliness, process parameters, etc., have been exhausted, one thing that can be tried to improve the wirebond to the board if space permits is to do a security bond. A security bond is where after making the second bond or fishtail bond to the board, you make a ball bond that overlaps the original fishtail bond and the board, then make the second fishtail bond either to a near by scrap area of the board pad or right on top of the second ball bond if the machine and process co-operates and lets you. This only can work if there is enough space on the board pad to do this. The exact location of the securitybond in relation to the original fishtailbond is CRITICAL. Verify the exact location with experimentation and testing. The wrong location can weaken the original fishtail bond without adding any benefits, so be careful. Also, this will slow down the process since you are doing double the bonding. Be sure to verify the results with proper testing. The area of breakage during the pull test is called the failure grade. There are different grading systems. A very thorough but harder to remember grading system is from MIL-STD-883 - method 2011. An easier grading system is what can be called a linear system where it starts with the low number or letter (1 or A) near the die chip and increase as the break is farther away. It is even possible to omit certain defects if it can be determined that either that defect will not happen or that it may not be detected and differentiated from another type of defect, such as die pad metalization lift and bond failure at die. Under casual observation, they sometimes may look similar. Because ultimately the production workers will be deciding what failure grade the pull tests are, use a grading system that they are capable of understanding. If they can understand the MIL-STD-883 system, so much the better. If the workers will have difficulty with the MIL spec., use a linear grading system. But try to choose one that will meet your needs now and in the future because if you need to change it later, people will need to un-learn the old system and the old data records may be misinterpreted later. The kind of machines and equipment used in the die bonding and wirebonding process can make or break the operation. The machines should be capable, versatile, reliable and easy to use. Unfortunately, machines often are a compromise of those qualities. In addition to the machines, another critical piece of equipment is the capillary, or in other words, the tool tip or bit that presses the wire against the die. A fairly recent addition to the equipment scene is the Capillary Heater. By heating the capillary, sometimes the board heat can be reduced if it was too close to the glass transition temperature tg of the board thus making the board soft. The heated capillary sometimes also can allow decreasing the ultrasonics and/or the force if the die was getting damaged. On a cautionary note, sometimes capillary heaters are fussy, and can interfere with the accuracy of the force and ultrasonics. How can we minimize the problems with wirebonding? By doing things right. For good advice about wirebonding as well as diebonding and other related micro-electronics operations, Better Wirebonding. A site devoted to serving the needs of the microelectronics industry in making interconnections with wirebonds. Contact us by Email only, phone calls are subject to DO NOT CALL penalties. Interesting Links: Micro-Electronics: Failure Grades Diebonds.com Electronics - Nordic Electronics Packaging Guide L.E.D. museum Other: Convert Metric-USA Obvious & Obscure Popular Incorrect Scientific Ideas Museum of Questionable Medical Devices Urban Legends New Kind of Camera, Light Field Camera Find Many US Government Web Sites Contact wirebonds.com by Email only, phone calls are subject to DO NOT CALL penalties.

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  Domain Name: WIREBONDS.COM
  Domain ID: 68375620
  WHOIS Server: whois.directnic.com
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  Updated Date: 2016-03-27T18:38:16Z
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